Mitsubishi Chemical Corporation
Semiconductor Incubation Dept.
- Language
2products.
[Close all]
In Development
Inorganic particles with negative thermal expansion (NTE) properties. When compounded into resin materials, they significantly reduce the coefficient of thermal expansion (CTE), improving dimensional stability.
- ※M-Filleris™ is a family of functional fillers developed by Mitsubishi Chemical for semiconductor materials and advanced packaging applications.
High thermal conductive BN sheet
[Close all]
Proprietary BN fillers which have features of high thermal conductivity and isolation are packed into the resin sheet at high density. High-purity epoxy resin is developed and used as binder. It is suitable for power modules used in inverters, and achieves both thermal resistance and isolation equivalent to those of ceramic plate (in-house measurement result).
- Product Finder
-
