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Proprietary BN fillers which have features of high thermal conductivity and isolation are packed into the resin sheet at high density. High-purity epoxy resin is developed and used as binder. It is suitable for power modules used in inverters, and achieves both thermal resistance and isolation equivalent to those of ceramic plate (in-house measurement result).

We provide various materials for electronic equipment parts that have excellent flame resistance, UV printability, and mechanical properties.