Semiconductor SolutionsPackaging Process

Characteristics：

With a comprehensive lineup of polyester film, ranging from a few microns to 350 microns in thickness and featuring well-balanced characteristics.

Form：

Film

DIAFOIL™ Product Page

Characteristics：

This soft polyolefin film, made using proprietary technologies, excels in the areas of workability and printability.

Form：

Film

DiaPlus Film Inc.
ARTPLY™ Product Page[Open in a new window]

Characteristics：

This material offers excellent electrical insulation properties and strong adhesion to metals, ceramics, and concrete. It is widely used in encapsulants and laminated boards.

Form：

Solid / Liquid

jER™ Product Page

Characteristics：

M-Filleris™ NTE series is a crystalline inorganic particle that exhibits negative thermal expansion (NTE), meaning it contracts when heated. When compounded into resin materials, it significantly reduces the coefficient of thermal expansion (CTE), improving dimensional stability.

M-Filleris™ NTE series Product Page

Characteristics：

㎛‑scale bump processing supports advanced semiconductor miniaturization and 3D integration, enabling assembly temperatures below 100℃. Order starting from a single wafer.

Form：

Contract Processing

Shinryo Corporation
Micro-bumps Product Page[Open in a new window]

Characteristics：

This resin sheet, densely packed with our proprietary BN filler, offers high thermal conductivity and excellent insulation properties.

Form：

Sheet

BN sheet Product Page

Characteristics：

High‑performance films (a few to 350 µm) with outstanding heat, dimensional, and chemical stability—ideal for ceramic capacitor release liners.

Form：

Film

DIAFOIL™ Product Page

Characteristics：

This soft polyolefin film, made using proprietary technologies, excels in the areas of workability and printability.

Form：

Film

DiaPlus Film Inc.
ARTPLY™ Product Page[Open in a new window]