Proprietary BN fillers which have features of high thermal conductivity and isolation are packed into the resin sheet at high density. High-purity epoxy resin is developed and used as binder. It is suitable for power modules used in inverters, and achieves both thermal resistance and isolation equivalent to those of ceramic plate (in-house measurement result).

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Features

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High thermal conductivity, high isolation performance

Proprietary BN fillers which have features of high thermal conductivity and isolation are packed into the resin sheet at high density. High-purity epoxy resin is developed and used as the binder. High heat conduction paths are secured by the optimized composition of the filler and the resin. Furthermore, high isolation voltage is achieved by less charge transfer resulting from high purity epoxy and void-less manufacturing process. As the results, it achieves both thermal resistance and isolation equivalent to those of ceramic plate.


Thermal resistance in prototype power module
(2in1 IGBT module,chip size=64mm2)
Thermal resistance in prototype power module

High reliability through small warpage and less-soldering

Coefficient of thermal expansion (CTE) of resin sheet was optimized as the same level as that of copper. As the results, IMS (Isulated Metal Substrate) keeps small deformation & warpage over the temperature change and it can make amount of soldering & grease much less in jointing.

Copper can be designed much thicker and IMS design without a base plate is available. These advantages contribute not only the cost reduction but also improvement of reliability.

Large-sized IMS and easy for design

Large-sized IMS is realized because of optimization of CTE. Overall process cost reductions can be expected through flexibility in module design and simplified mounting process.

Characteristics

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Recommended structures Upper copper (t=0.5mm) / BN sheet (t=0.15mm) / Lower copper (t=2mm)
Thermal conductivity of BN sheet 16.5W/mK (typical)
Isolation voltage 8kV (typical)
CTE 18ppm (R.T.)

Inquiries Concerning Products


Mitsubishi Chemical Corporation
Global Strategy Dept. Information & Electronics Dept.

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