High thermal conductive BN sheet

Designed for laminating transfer-molded power modules to cooling plates. A single resin sheet provides insulation, heat dissipation, and adhesion, contributing to improved module reliability, reduced total cost, and a lower-profile design.

High Thermal Conductivity & High Dielectric Strength

A proprietary design uses high-density BN filler and newly developed high-purity epoxy resin. By optimizing filler composition and molding conditions, efficient heat conduction paths are formed while minimizing charge migration and voids, achieving both high thermal conductivity and excellent dielectric strength.

Enhanced Reliability & Durability

The coefficient of thermal expansion of the resin sheet is optimized. Thicker copper layers (compared to ceramic substrates) can be applied, improving heat dissipation. Combined with low deformation and minimal warpage during temperature cycling, this significantly enhances durability under thermal stress.

Maintained Flexibility

The proprietary BN filler design enables high thermal conductivity even at relatively high resin content. This allows the sheet to maintain flexibility and ease of handling while delivering excellent thermal performance.

Compatible with large insulated metal substrates (IMS). Enables fabrication of large patterned boards, improving design flexibility, simplifying assembly, and contributing to overall cost reduction.