- Mitsubishi Chemical Corporation
Information Electronics Technology Development Division
Semiconductor Incubation Department
Negative Thermal Expansion FillerM-Filleris™ NTE series
Mitsubishi Chemical Corporation- Language
In Development
Inorganic particles with negative thermal expansion (NTE) properties. When compounded into resin materials, they significantly reduce the coefficient of thermal expansion (CTE), improving dimensional stability.
- ※M-Filleris™ is a family of functional fillers developed by Mitsubishi Chemical for semiconductor materials and advanced packaging applications.
Key Features of M-Filleris™ NTE series
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M-Filleris™ NTE series is a crystalline inorganic particle that exhibits negative thermal expansion (NTE), meaning it contracts when heated. When compounded into resin materials, it significantly reduces the coefficient of thermal expansion (CTE), improving dimensional stability.
- Significantly reduces thermal expansion when compounded in epoxy resins, etc.
- Negative thermal expansion characteristics over a wide temperature range from room temperature to 400℃
- Excellent fluidity and dispersibility due to its spherical shape
- Low alpha particle emission through impurity control (reduction of soft errors)
- Specific gravity and low water absorption comparable to general semiconductor fillers (silica fillers)
- Applications to semiconductor encapsulants, underfill materials, build-up film materials, etc.
Applications
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Semiconductor Applications
- Semiconductor Encapsulation Materials
- Electrical Insulation Materials
- Package Substrate Materials
- Photosensitive Dielectric Materials
Leveraging the synergy with Mitsubishi Chemical’s established epoxy resin business, we offer not only fillers themselves but also masterbatches pre-compounded with epoxy resins and other materials.
M-Filleris™ NTE series Video
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