We offer proven materials solutions supporting FEOL miniaturization, including lithography, deposition and etching, as well as CMP and cleaning processes.
From our broad lineup, we deliver process‑specific materials and technologies optimized for each process and equipment requirement.

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Semiconductor Process Solution

Inquiries

Deposition

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CVD/ALD Precursors

Characteristics：
High‑performance precursors deliver excellent thin‑film quality for advanced broad application with barrier layer, dielectric deposition under low-temp, Area selective deposition.
Form：
Gas or Liquid

Gelest Inc.
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Lithography

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Antistatic Agent for Electron Beam aquaSAVE™

Characteristics：
This antistatic agent suppresses charge accumulation on photoresist during electron beam lithography. By reducing charge-up defects, it supports stable, high-precision photomask fabrication for advanced fine-patterning.
Form：
Liquid

aquaSAVE™ Product Page

Photo Resist Photosensitive Polymer Lithomax™

Characteristics：
High-purity, low-metal photosensitive polymer for semiconductor photoresists, designed to enable reliable fine-pattern circuit fabrication.
Form：
Liquid

Lithomax™ Product Page

CMP・Cleaning

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Ultra High Purity Process Chemicals for Semiconductor/FPD EL Hydrochloric Acid

Characteristics：
Our EL hydrochloric Acid can realize metal impurities below 10ppt
Form：
Liquid

Star Series Product Page

Advanced Cleaning Solutions Formulated Wet Chemicals

Characteristics：
Our product achieves exceptionally high cleaning performance on patterned copper wiring and low-k surfaces with hydrophobic properties.
Form：
Liquid

MCX-SDR4 Product Page

Inquiries Concerning Products

Mitsubishi Chemical Corporation
Comprehensive Semiconductor Solutions

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