We supply GaN substrates for power device applications.
We also develop advanced thermal management materials—including insulating heat‑dissipation sheets and low‑CTE materials—and provide solutions tailored to customer quality requirements. Please feel free to contact us for further information.

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Semiconductor Process Solution

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Gallium Nitride (GaN) Substrate

Characteristics:
Our Gallium Nitride (GaN) substrate is a high-quality single-crystal substrate produced using epitaxial technology known as HVPE and compound semiconductor processing techniques. It is characterized by uniform, high-quality crystallinity and surface quality.
Form:
Wafer

Gallium Nitride (GaN) Substrate Product Page

Thermal Management

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High thermal conductive BN sheet

Characteristics:
This resin sheet is ideal for power modules, offering high thermal conductivity and electrical insulation comparable to silicon nitride substrates (based on in-house evaluation).
Form:
Sheet

BN sheet Product Page

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Mitsubishi Chemical Corporation
Comprehensive Semiconductor Solutions

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