We provide materials that support BEOL miniaturization and high‑density interconnects, covering CVD and ALD, lithography, CMP and cleaning, and multilayer interconnect formation.

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Semiconductor Process Solution

Inquiries

Deposition

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CVD/ALD Precursors

Characteristics：
High‑performance precursors deliver excellent thin‑film quality for advanced broad application with barrier layer, dielectric deposition under low-temp, Area selective deposition.
Form：
Gas or Liquid

Gelest Inc.
CVD/ALD Product Page[Open in a new window]

CMP・Cleaning

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Engineering plastic Techtron™

Characteristics：
Minimal moisture absorption and a very low coefficient of linear thermal expansion, combined with stress relieving processes. Application is retainer ring.
Form：
Cylindrical / Plate Solid

Mitsubishi Chemical Advanced Materials
Techtron™ Product Page[Open in a new window]

Polyethylene Terephthalate Semitron™

Characteristics：
Optimized for use in CMP retaining rings, Semitron™ CMP LL5 is a high-performance PET-P material with a superior wear life.
Form：
Cylindrical / Plate Solid

Mitsubishi Chemical Advanced Materials
Semitron™ Product Page[Open in a new window]

Advanced Cleaning Solutions Formulated Wet Chemicals

Characteristics：
Our product achieves exceptionally high cleaning performance on patterned copper wiring and low-k surfaces with hydrophobic properties.
Form：
Liquid

MCX-SDR4 Product Page

Inquiries Concerning Products

Mitsubishi Chemical Corporation
Comprehensive Semiconductor Solutions

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