Adhesive and easy peel sealant resin MODIC™
- Mitsubishi Chemical Corporation
- Performance Polymers Dept.
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MODIC™ tie-layer resin is acid grafted polyolefin forming a layer or a coating which provides adhesion between materials that have poor affinity. Formulations are adapted to PE, PP, EVOH, PA, PS, PET, PBT, PC, metal and glass and may be used for:
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Modic™-Peelable easy peelable sealant resins are designed through our wide experience in polymer modifications and compounding technologies.
These polymer alloys are used in various lidding film applications for smooth & easy peel functions with little or no residue after peeling.
It can be used in a wide range of heat seal temperatures to achieve stable & uniform seal/peel characteristics. We have various direct food compliant grades for PP; PS; PE; PET & PLA substrates.
Our resins are suitable for conventional processing such as blown or cast film and also by lamination.
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Adhesive and easy peel sealant resin MODIC™
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