Si Etchant Series is a silicon wafer etching acid for spin etching processer that eliminates damaged process layers from wafer surfaces.

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Characteristics

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Si Etchant Series is a silicon wafer etching acid for spin etching processer. It is ideal for eliminating damaged process layers from wafer surfaces and for processing mirrored or rough surfaces.

Applications

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  • Back side etching process, Elimination of damaged process layers, Uniformity, Stress release mirror etching, and roughness etching.
  • Wet etching, spin etching devices, single wafer wet processors, dedicated devices for auto supplying highly pure chemicals for semiconductor processes.

Si etch series list

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  1. 1.Mirrored surface processing acids
    • Si etch E Etch rate: 25µm/min.
    • Si etch F Etch rate: 20µm/min.
    • Si etch J Etch rate: 8µm/min.
  2. 2.Mirrored surface finishing acid
    • MH-3 Etch rate: 10µm/min.
  3. 3.Mirrored surface processing acids
    • Si etch C Etch rate: 3µm/min.
    • Si etch D Etch rate: 2µm/min.

Processing example

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Mirror Etching(Si-E)

Before Etching After Etching
Laser microscope [magnification: 1000 times]




Crystal Axis <100 > conductive type P type, resistance (0.013-0.020Ωcm) acid etching surface





Roughness Etching

Etching by Si-D

Etching by Si-C



Crystal Axis <100 > conductive type P type, resistance (0.4-0.6Ωcm) Crystal Axis <100 > conductive type P type, resistance (0.005-0.007Ωcm)

Inquiries Concerning Products

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