a silicon wafer etching acid for spin etching processerSi Etchant Series
Mitsubishi Chemical CorporationSi Etchant Series is a silicon wafer etching acid for spin etching processer that eliminates damaged process layers from wafer surfaces.
Characteristics
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Si Etchant Series is a silicon wafer etching acid for spin etching processer. It is ideal for eliminating damaged process layers from wafer surfaces and for processing mirrored or rough surfaces.
Applications
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- Back side etching process, Elimination of damaged process layers, Uniformity, Stress release mirror etching, and roughness etching.
- Wet etching, spin etching devices, single wafer wet processors, dedicated devices for auto supplying highly pure chemicals for semiconductor processes.
Si etch series list
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- 1.Mirrored surface processing acids
- Si etch E Etch rate: 25µm/min.
- Si etch F Etch rate: 20µm/min.
- Si etch J Etch rate: 8µm/min.
- 2.Mirrored surface finishing acid
- MH-3 Etch rate: 10µm/min.
- 3.Rough surface processing acids
- Si etch C Etch rate: 3µm/min.
- Si etch D Etch rate: 2µm/min.
Processing example
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| Before Etching | After Etching |
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| Laser microscope [magnification: 1000 times] | |
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Crystal Axis <100 > conductive type P type, resistance (0.013-0.020Ωcm) acid etching surface |
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Etching by Si-D |
Etching by Si-C |
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| Crystal Axis <100 > conductive type P type, resistance (0.4-0.6Ωcm) | Crystal Axis <100 > conductive type P type, resistance (0.005-0.007Ωcm) |
Inquiries Concerning Products
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