Mie R&D Center
①Heat resistance and flame retardant epoxy resin for semiconductors
We develop epoxy resins for encapsulants that are used in electronic parts. Our special epoxy resins are characterized by superb heat resistance, low melt viscosity, and low water absorptivity, and they are used as de-facto standard encapsulants. We develop new epoxy resins characterized by excellent flame resistance, etc. in order to meet ever-higher required characteristics.
②Polyester polymer for display film
To impart slippage to films, we develop polyester with submicron particles that are uniformly distributed.
③Catalyst & process for acrylic acid production by propylene oxidation
Acrylic acid is used for various applications including super water-absorbent polymers.
We develop catalysts with characteristics including high activity, high selectivity, and long service life. We continue to offer technologies that meet internal and external needs.