Characteristics and Advantages

  • High thermal conductivity
  • High strength
  • EMI shield

Heat radiation test

  • Front cover : High thermal conductivity materials.
  • Back cover : PA-GF
  • Temperature measurement point :
    Near the circuit in the cover.
  • The electric power : 1.4W

Temperature on circuit board with various covers

EMI shield
*NX-C-30:Electromagnetic shield grade

*)All technical information and data are typical values, and are not standard values.

Applicable components

  • Development of cover for heat radiation

Proposal for the future

  • Aluminum die casting → Reduction of the secondary process cost
  • Conventional thermal conductive polymer → Reduction of the parts
  • Conventional polymer → Corresponding of high speed IC

VA suggestion by UNX7007　High thermal conductive / High strength / EMI shield polymer（[PDF]576 KB）

Carbon Fiber Reinforced Thermoplastic Resin Pyrofil™ Pellets

Contact

Mobility Segment, East Japan Branch

  • TEL:+81-3-6748-7531